TECHNET Archives

August 1999

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Jack Olson <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 18 Aug 1999 10:05:48 -0700
Content-Type:
text/plain
Parts/Attachments:
text/plain (77 lines)
Call the customer!
(sometimes they appreciate knowing what's going on with their products...)

one customer's opinion,
Jack

                -----Original Message-----
                From:   Stephen R. Gregory [mailto:[log in to unmask]]
                Sent:   Tuesday, August 17, 1999 4:43 PM
                Subject:        Via Fill...(I know ya'll are sick of this!
BUT...)

                Hey ya'll!

                Well, I got about a 50/50 split about whether or not it's
important that vias
                fill with solder or not...more precisely, the one's that do
fill need to be
                at least 75% full. To add to that, Werner jumps in and says
something about
                that it makes a difference whether the vias in question are
at the outer
                edges of the board, or in towards the center...hoo-boy, I
hate it when he
                confuses me with the facts!

                What I once thought was fairly a non-issue, now seems to
have taken on some
                significance. But I'm still stuck with these boards. I don't
know the precise
                operating environment, but I do know what they do. It's for
a mail sorting
                system...we have several boards that we build that go into a
system that
                sorts mail by reading the barcode on each piece of mail as
it whips by at
                "warp speed" and sorts it by zipcode and whatnot...don't
think it's gonna see
                extreme environments (unless they'll have these systems down
in Antartica,
                but I don't think so because there ain't the volume of mail
coming outta that
                place that needs a automated system such as this...hehehe)
so I think the
                temp cycling will be pretty benign...but then again, I'm
really guessing.

                Hate to scrap all these boards, and also hate to have to put
all the labor
                into masking all the damn vias just to be sure they don't
fill...also hate to
                call the customer and ask them if it's okay to run with
these boards...they
                may, or may not have the insight that the TechNet list has
about these issues
                in which case I may appear as "the boy who cried wolf" which
makes me feel
                real enthusiastic about this whole deal...

                I'm just gonna come out and ask; what should I do?

                -Steve Gregory-

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in
the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information.
If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or
847-509-9700 ext.5365
##############################################################

ATOM RSS1 RSS2