TECHNET Archives

April 1998

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Mime-Version:
1.0
Sender:
X-To:
Date:
Fri, 3 Apr 1998 08:43:21 EST
Reply-To:
"TechNet E-Mail Forum." <[log in to unmask]>, Robisan1 <[log in to unmask]>
Content-type:
text/plain; charset=US-ASCII
Subject:
From:
Robisan1 <[log in to unmask]>
Content-transfer-encoding:
7bit
Parts/Attachments:
text/plain (29 lines)
I am surprised that Surface Insulation Resistance Testing
is not included in this test comparison since that test is the
only one which determines if the residues left on boards
impact performance.

To leave the one functional test out of this test program
means only that different tests can extract different amounts
of materials, but the question still exists - what does the
presence of the material on the board mean.

I would strongly suggest that the test program be rethought
to include sir testing.

Susan Mansilla
Technical Director
Robisan Laboratory

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information.
For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311
################################################################


ATOM RSS1 RSS2