DeWetting refers to solder flowing over a suitable surface, then pulling
away during the removal of work from solder, or during cooling. The "pulling
away" gives it that flat appearance.
Air pressure over work during HASL can give the appearance of "dewetting";
however, since this was a mechanical (air pressure) action causing the
appearance of dewetting, and not a contaminate (as during solder dip or
solder flow) then although the appearance is there it should not actually be
confused with, or classified as...dewetting...
Just my thoughts...
Franklin
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