Ryan , as far as Palladium recommended fluxing/process , perhaps if you'd
forwarded your original to Doug ;
he'd be likely more than sufficiently across your puzzle .
Doug, as yo gave few good insights on LF ; there is a debate on TN seemingly
on palladium wetting ;
my apologies to drag you across to coals .
I'd be interested in recommended paste myself = to reflow TI finish
optimally ;
i'd presume extensive validations would be done/documented ?
Thanks a lot
Paul Klasek
http://www.resmed.com <http://www.resmed.com>
-----Original Message-----
From: Romm, Doug [mailto:[log in to unmask]]
Sent: Thursday, 17 February 2000 4:32
To: [log in to unmask]
Subject: Re: [LF] Components
Hans, yes, there are lead-free components (other than passives) available in
the market. This forum is not intended as a marketing source, but I will
mention to you that Texas Instruments supplies Ni/Pd finished components
(lead-free) now. This lead-free finish has been in the market since 1989
and to date over 30 billion Ni/Pd components are in the field. You can see
technical information on this finish at this web site:
http://www.ti.com/sc/docs/products/logic/package/palladm/index.htm
<http://www.ti.com/sc/docs/products/logic/package/palladm/index.htm>
Of course, one of the major issues with lead-free processing and plastic
packages is the dramatic increase in peak reflow temperature with some of
the alloys, with the peak sometimes as high as 260C. TI, along with other
components suppliers, is working with industry consortia to characterize
moisture performance of current package technology at these higher reflow
temperatures.
Best regards, Doug Romm
-----Original Message-----
From: <Hans Juergen Bauer> [ mailto:[log in to unmask]
<mailto:[log in to unmask]> ]
Sent: Wednesday, February 16, 2000 10:45 AM
To: [log in to unmask]
Subject: [LF] Components
Dear Colleagues,
is in this circle participating anyone, who takes care of the
components, soldered with leadfree processes??
As I resume a lot of the last messages, nobody is realizing the
suffer of a lot of component commodities. It is clear, that a
board with only some different ceramic components on it, is
solderable leadfree. What about telecoms boards, containing a
lot of different kind of components?
I am curious about the answer,
Hans Juergen
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