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Mon, 18 May 1998 08:56:45 +0200 |
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Ericsson Radio Systems AB Kumla |
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Milind Rao wrote:
>
> Sorry for my earlier mail without subject
> ------------
> Hi
> We are getting particles in both component holes / via holes on and off
> and in double sided / multilayer boards. This is observed after pattern
> plating
> We use High build copper and Pattern plating.
> In some holes the particles are severe and reduce the hole size
> considerably. The problem is occuring very randomly.
> Has anybody got remedy for this ?
> Thanks in advance for the help
> Milind
>
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Hello!
I`ve seen a similar probelm. Go to your electroless. Look at the
conditioning step. Feel the side walls of the rinse tank afterwards.
If it`s slippery, well then you might have an algea problem.The algea
get stuck in the holes, gets activated and then plated.
Good luck!
Peter Fogelqvist
Ericsson Circuits
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