Subject: | |
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Reply To: | TechNet E-Mail Forum. |
Date: | Mon, 22 Jul 2002 11:36:22 -0600 |
Content-Type: | text/plain |
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Steve,
As I mentioned, it was published in Feb this year. It's a good paper, worth
reading.
Regards,
Bruce Misner
> ----------
> From: Steve Gregory[SMTP:[log in to unmask]]
> Reply To: TechNet E-Mail Forum.;[log in to unmask]
> Sent: Monday, July 22, 2002 12:20 PM
> To: [log in to unmask]
> Subject: Re: [TN] Au-Ni coating
>
> I've never heard/read anything about uncured soldermask either. I've got a
> pretty good *.PDF file authored by Nicholas Biunno of Hadco, and presented
> at the '99 IPC Printed Circuits Expo that doesn't mention anything about
> soldermask...is this something new?
>
> -Steve Gregory-
>
>
>
>
> Bruce:
>
> My understanding of Black Pad was it is caused by too much
> phosphorus in the nickel (as I recall) plating bath.
> Solder mask contamination is a new one for me.
> With mask going on after the gold, how does it contaminate the
> nickel? Mask should not come in contact with the nickel at all in my
> experience
>
> I am interested in learning all nuances of black pad causation.
> Would appreciate your comments.
>
> Charlie McMahon
>
>
>
>
>
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