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Fri, 12 May 2000 08:16:23 -0700 |
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C-MAC Electronic Systems Inc. |
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I need to install two SMD chips (0805) at one location. I referred to
IPC-HDBK-001, fIG 6-24.
When I solder the chips side by side, the ceramic side which is placed
against solder pad- is already touching the solder. While I complete the
solder joint, the solder fillet is too close to deposited element. ( As
distance between end termination's is more the inner gap between solder
pads)
My question is :
1. Does any one know a vendor who can supply 5 sided termination (
similar to Chip Capacitors) for thick film resistors?
2. Which one is less evil: Piggy back chips( not recommended by IPC) or
solder touching the component body?
3. Any other idea?
I will appreciate your time for advice.
Ashok
--
Ashok Dhawan P.Eng
Engineering
C-Mac Electronic Systems Inc.
1455 Mountain Avenue
Winnipeg, Manitoba R2X 2Y9
Canada
Phone: (204) 631-7208
Fax: (204) 631-7294
E-mail: [log in to unmask]
www.cmac.ca
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