 
| Sender: |
|
| X-To: |
|
| Date: |
Tue, 9 Jan 2007 17:58:05 -0000 |
| Reply-To: |
|
| Subject: |
|
| From: |
|
| Content-Transfer-Encoding: |
base64 |
| In-Reply-To: |
|
| Content-Type: |
text/plain; charset="utf-8" |
| MIME-Version: |
1.0 |
| Parts/Attachments: |
|
|
Werner,
Cheers, you've confirmed my initial thought's!.....time for some debate!
Regards,
Iain.
-----Original Message-----
From: [log in to unmask] [mailto:[log in to unmask]]
Sent: 09 January 2007 17:42
To: Braddock, Iain; [log in to unmask]
Subject: Re: [TN] Component qualification!
*** WARNING ***
This mail has originated outside your organization,
either from an external partner or the Global Internet.
Keep this in mind if you answer this message.
Hi Iain,
You are correct—no 'carte blanche' capability can be assumed given the limits we are pushing.
And it is not just "the difference in peak processing temperatures/component temperature limitations," but also moisture content and multiple solder temperature excursions that come into the picture.
Werner
********************************************************************
This email and any attachments are confidential to the intended
recipient and may also be privileged. If you are not the intended
recipient please delete it from your system and notify the sender.
You should not copy it or use it for any purpose nor disclose or
distribute its contents to any other person.
********************************************************************
|
|
|
