LCP is a flex material from Roger's. The Gore equivalent is Biac. There
is some concern in the industry that the LCP material has issues in high
layer count applications. The Biac has Teflon in it. So far as I am
aware they have not come up with anything to bond to it.   You can also
obtain 9  micron copper/25 micron kapton/ 9 micron copper from DuPont -
again another flex material. Regards Steve Kelly



PFC Flexible Circuits Limited

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Adair, Bret
Sent: Friday, September 13, 2002 12:29 PM
To: [log in to unmask]
Subject: Re: [TN] Looking for very thin, Low Dk and Low loss material



You may want to try liquid crystal polymer (LCP).  LCP is a flexible
material with a Dk of 2.9, a Df of .002 and CTE of 17ppm.  I believe
that the material is .002 as a standard thickness.

I know that Yamaichi and Rogers make LCP, and I think that Gore does
also.

Bret

-----Original Message-----
From:   Tim Reeves [mailto:[log in to unmask]]
Sent:   Friday, September 13, 2002 8:20 AM
To:     [log in to unmask]
Subject:        Re: [TN] Looking for very thin, Low Dk and Low loss
material

I am aware only of PTFE and Gore speedboard C (contains PTFE) having a
dielectric constant that low.

see
http://www.goreelectronics.com/products/dielectric_materials/Speedboard_
C_Prepreg.html





Hello,



-----Original Message-----
From: SDC's Tech Net [mailto:[log in to unmask]]
Sent: Thursday, September 05, 2002 7:30 PM
Subject: Looking for very thin, Low Dk and Low loss material



Hello everybody,
        I am in need of core material and prepreg material with very low

Di-electric constant(Dk) and low loss factors.Dk is about 3.0 or less
with
very thin profile of the material.Di-electric thickness spec will be
2.4mil
or less.Any help on the subject will be appriciated.

Thank you all
Kris Vasoya
VP of Operations.
Thermal Works
ph:714-540-8454 Ext:136
fax:714-540-1299
e-mail: [log in to unmask]
www.thermalworks.com

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