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March 2018

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TechNet <[log in to unmask]>
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Mon, 5 Mar 2018 07:00:21 +0000
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TechNet E-Mail Forum <[log in to unmask]>, Tan Geok Ang <[log in to unmask]>
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Subject:
Re: LCC package pads/terminals qualification test
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Tan Geok Ang <[log in to unmask]>
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I don’t think there is any standard for terminal/pad of LCC packages unless it is being attached to lead- frame e.g flat pack package. Do share your thought and advice if there is some requirements and applicable standard. Thanks

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From: Tan Geok Ang <[log in to unmask]>
Date: 3 March 2018 at 8:43:18 AM SGT
To: [log in to unmask] <[log in to unmask]>
Subject: [TN] LCC package pads/terminals qualification test

What the standards are applicable to ensure and qualify the pads strength requirement for this package. Thanks

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