Subject: | |
From: | |
Reply To: | TechNet E-Mail Forum. |
Date: | Fri, 26 Mar 1999 08:55:23 -0800 |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
Hi Phil,
Plastic components should not be subjected to processes which contain
halides. I believe most tin/lead strippers contain fluorine or chlorine
which are considered a no-no as far as package reliability is concerned.
All you need is a little moisture to drive the halides to the die
surface where they will corrode the aluminum bond pads.
In addition, you would probably need a layer of immersion nickel under
the immersion gold so this concept is getting very complicated.
Regards, Russ Winslow
Six Sigma
1940 Concourse Drive
San Jose, CA 95131
[log in to unmask]
http://www.sixsigmaservices.com
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Phil Hersey
Sent: Wednesday, March 24, 1999 3:09 PM
To: [log in to unmask]
Subject: [TN] SMT, replace solder with conductive epoxy?
What if... you took all your standard SMD devices, threw them in an
etchant
to get rid of the tin/lead, immediately took them out and threw them in
an
immersion "flash" gold bath, then used conductive epoxy to mount them to
a
flash gold/nickel PCB rather then solder?
Does this seem feasible? (technically at least)
Resp.
Phil Hersey, Carson City Nevada USA
################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV
1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with
following text in the body:
To subscribe: SUBSCRIBE TechNet <your full name>
To unsubscribe: SIGNOFF TechNet
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services"
section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or
847-509-9700 ext.312
################################################################
################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe: SUBSCRIBE TechNet <your full name>
To unsubscribe: SIGNOFF TechNet
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################
|
|
|