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October 2004

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Subject:
From:
Vu Dinh Tang <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Vu Dinh Tang <[log in to unmask]>
Date:
Thu, 14 Oct 2004 09:07:20 +0700
Content-Type:
text/plain
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text/plain (55 lines)
David,
Just look at:
http://www.intertronics.co.uk/general/contact.htm
or
http://www.ixxi.com/index.htm

TANG
----- Original Message -----
From: "David Tremmel" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Wednesday, October 13, 2004 10:59 PM
Subject: [TN] BGA Reballing Kit


> Dear Technetters,
>
> A couple of years ago, I saw at the ATExpo a BGA reballing system for
small
> volumes.  You placed the components in a holder, put on a stencil and
> spheres and baked the whole assembly in an oven.
>
> If anyone is familiar with the name of the company(s) or the procees, I
> thank you in advance for you help.
>
> David Tremmel
>
> _________________________________________________________________
> MSN Latino: el sitio MSN para los hispanos en EE.UU.
http://latino.msn.com/
>
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