TECHNET Archives

May 1997

TechNet@IPC.ORG
Options: Use Proportional Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Received:
by ipc.org (Smail3.1.28.1 #2) id m0wX4tB-000BjFC; Thu, 29 May 97 08:05 CDT
Old-Return-Path:
<[log in to unmask]>
Date:
Thu, 29 May 1997 09:15:15 -0400 (EDT)
Precedence:
list
Resent-From:
[log in to unmask]
Resent-Sender:
TechNet-request [log in to unmask]
X-Status:
Status:
O
X-Mailing-List:
<[log in to unmask]> archive/latest/12987
TO:
[log in to unmask]
Return-Path:
<TechNet-request>
From [log in to unmask] Thu May 29 10:
00:12 1997
>From bergdi Thu May 29 08:
05:31 1997
From:
[log in to unmask]
Message-ID:
<[log in to unmask]>
X-Loop:
[log in to unmask]
Resent-Message-ID:
<"fpF-O1.0.PTI.3yNZp"@ipc>
Subject:
Re: ASSY:Au/Ni Coated Boards
Parts/Attachments:
text/plain (25 lines) 
Hello 

I am very surprised that after six months your boards lost solderability. As
you mentioned, it is possible that the nickel migrates through the pores and
oxidizes. 

We can provide the analysis of the gold finished boards in order to detect
the oxidation of the nickel. The thickness of the gold deposit can be
measured too.


Mike Pavlov
[log in to unmask]

***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To subscribe/unsubscribe send a message <to: [log in to unmask]>   *
* with <subject: subscribe/unsubscribe> and no text in the body.          *
***************************************************************************
* If you are having a problem with the IPC TechNet forum please contact   *
* Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask]      *
***************************************************************************

ATOM RSS1 RSS2