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July 2000

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Wed, 5 Jul 2000 23:14:20 EDT
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"TechNet E-Mail Forum." <[log in to unmask]>, [log in to unmask]
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"Stephen R. Gregory" <[log in to unmask]>
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In a message dated 07/05/2000 9:58:00 PM Central Daylight Time,
[log in to unmask] writes:

> Hi, Technetter,
>  Is there anyone out there using 0402 in mass production and is doing
> inspection
>  on them? What is the inspection approach on such small chips? Besides,
will
> the
>  process control approach on 0402 be very different from that of 0805/0603?
>  Thanks.
>
>  Regards,
>  KenF, Jul 6,00

Hi Ken!

We do boards that have 0402's and there are certain things that we do to
prevent defects. The biggest defect from my experience that happens is
tombstoning. Most of the time this problem is attributible to paste printing
or placement. The paste print needs to be deadly accurate, as well as the
placement...both of these need to be dead-on. Otherwise, you'll wind-up with
soldiers standing at attention...not a good thing. Inspecting under a
microscope on first articles is a must!!!

Accuracy is the key...not to mention good pad layout.

-Steve Gregory-

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