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April 2018

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TechNet <[log in to unmask]>
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TechNet E-Mail Forum <[log in to unmask]>, Wayne Showers <[log in to unmask]>
Date:
Sat, 14 Apr 2018 01:20:59 +0000
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TechNet E-Mail Forum <[log in to unmask]>, Tan Geok Ang <[log in to unmask]>
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Subject:
Re: Vacuum Baking
From:
Tan Geok Ang <[log in to unmask]>
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Hi Wayne,
Are you able to send me a copy? Thx

________________________________

From: Wayne Showers <[log in to unmask]>
Date: 14 April 2018 at 6:38:35 AM SGT
To: [log in to unmask] <[log in to unmask]>
Subject: Re: [TN] Vacuum Baking

You might want to check out this paper:
Characteristic Times of Moisture Diffusion and Bake-out Conditions for Plastic Encapsulated Parts
written by
Alexander Teverovsky
QSS Group, Inc./Goddard Operations
[log in to unmask]

I have emailed you a copy.  Of note is that the key temperature for any bake out under vacuum is 58C.

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