Happy New Year To All,

In order to utilize our current equipment and better
eval the future equipment, I need to some help on the
3- 5 year future of Memory Product.

Typically, at this moment,

DDRDIMM, RIMM, DIMM are 5.25" L and 1 - 1.7" Height,
using from micro BGA, 16 mils pitch component, to 31
mils.  For small component, 0402 is the smallest.

144 SODIMM is 2.66 L x 1 - 1.5 H, using the same
components as the above.

The ratio on DIMM is 4 small component/1 TSOP and 8/1
for DDR.

That is what I know for now.  This would last for 1
year.

How about the future?  Do you have any guild line from
Intel, ADM, Jedec? about component usage, small/big
component ratio, PCB outline? ...

Please advise.

Thanks,

Stacy

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