Happy New Year To All, In order to utilize our current equipment and better eval the future equipment, I need to some help on the 3- 5 year future of Memory Product. Typically, at this moment, DDRDIMM, RIMM, DIMM are 5.25" L and 1 - 1.7" Height, using from micro BGA, 16 mils pitch component, to 31 mils. For small component, 0402 is the smallest. 144 SODIMM is 2.66 L x 1 - 1.5 H, using the same components as the above. The ratio on DIMM is 4 small component/1 TSOP and 8/1 for DDR. That is what I know for now. This would last for 1 year. How about the future? Do you have any guild line from Intel, ADM, Jedec? about component usage, small/big component ratio, PCB outline? ... Please advise. Thanks, Stacy __________________________________________________ Do You Yahoo!? Send your FREE holiday greetings online! http://greetings.yahoo.com --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------