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July 1998

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Sender:
TechNet <[log in to unmask]>
X-To:
sahmad <[log in to unmask]>
Date:
Mon, 13 Jul 1998 12:37:21 -0400
Reply-To:
"TechNet E-Mail Forum." <[log in to unmask]>, Sean Heffernan <[log in to unmask]>
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text/plain; charset="US-ASCII"
Subject:
Re: Provide me your current BGA Spec on void
From:
Sean Heffernan <[log in to unmask]>
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<42B3AA35014D2400>
Organization:
QUADRUS MANUFACTURING
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1.0
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text/plain (23 lines) 
I am a programmer for a HP 5dx (x-ray), the way we determine a void as a
defect is, if the void is greater than 33 % of ball diameter after
collapse.  If non-collapable ball is being used, then still using 33 %.
So after collapsing the diameter of ball is 35 mil, any void >= 11.5-12.0
mil  is rejected.  Because there is really no standard yet, most of my
customers are happy with 33 %.

Sean M. Heffernan
Quadrus Manufacturing
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