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December 2013

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TechNet <[log in to unmask]>
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"Stadem, Richard D." <[log in to unmask]>
Date:
Thu, 26 Dec 2013 15:30:19 -0500
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TechNet E-Mail Forum <[log in to unmask]>, "Vladimir Igoshev. PhD" <[log in to unmask]>
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Subject:
Re: IPC-A-610E, Voids in Thermal exposed pad of QFNs
From:
"Vladimir Igoshev. PhD" <[log in to unmask]>
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SENTEC Testing laboratory Inc.
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If I knew I would be probably a very rich guy. But I'd defiantly not
rely on a technique which is not capable of capturing them.

My days back with RIM we worked with a component supplier to resolve
it and ALWAYS checked DESTRUCTIVELY every new batch!

  

-- 
Best regards,

Vladimir Igoshev. PhD                          mailto:[log in to unmask]

SENTEC Testing Laboratory Inc.
11 Canadian Road, Unit 7.
Scarborough, ON M1R 5G1
Tel: (416) 899-1882
Fax: (905) 882-8812
www.sentec.ca

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