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November 2001

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Subject:
From:
"Stephen R. Gregory" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 12 Nov 2001 19:47:11 EST
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Hi Bob!

Here's a couple of places to start:

http://www.imaps.org/adv_micro/2001jan_feb/3.html

http://www.aitechnology.com/enter.html

-Steve Gregory-






> We will soon need to apply adhesives to hold parts to the bottom side of the
> board during second reflow. Our products fly in space and have heavy duty
> requirements for thermal cycling and vibration. Do any of you who do
> aerospace SMT have favorite products for this purpose? We need an adhesive
> that meets NASA outgassing requirements and has a friendly coefficient of
> expansion?
>
> I need someplace to start our search. Thanks.



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