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March 1998

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TechNet <[log in to unmask]>
Subject:
Double Reflow: Component Weight vs. Pad Contact Area Ratio
From:
"Dave Pick -\"process engineer\"" <[log in to unmask]>
Date:
Mon, 23 Mar 1998 09:38:11 -0600
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"TechNet E-Mail Forum." <[log in to unmask]>, "Dave Pick -\"process engineer\"" <[log in to unmask]>
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TEXT/PLAIN (18 lines) 
I have read somewhere of a component weight to SMT lead contact area ratio rule
for double sided reflow. This ratio would be the maximum component weight to SMT
pad contact area that would allow surface tension to overcome gravity. If the
weight to surface area ratio is over this number, the part would fall off. Does
anyone know what this ratio is?

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