In a message dated 08/25/1999 1:56:11 PM Central Daylight Time, [log in to unmask]
writes:

<< On double reflow boards our ICT test engineers now want to solder paste the
 solder side test points prior to reflow. We do not see any advantage to this
 but about 2000 more holes in the stencil. What are your ICT people saying. >>

Hello Nick,

I've had to do this before with some floppy-drive controller boards we were
building...it ain't no big deal, just get another stencil. There are some
good reasons for them to ask for it...vacuum problems, probe contact, etc..
Pasting the via's very well could eliminate a bunch of false failures they've
been getting...

-Steve Gregory-

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in
the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information.
If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or
847-509-9700 ext.5365
##############################################################