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November 1997

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TechNet <[log in to unmask]>
Subject:
TSOP, TQFP reliability
From:
SVEBA <[log in to unmask]>
Date:
Thu, 27 Nov 1997 15:38:59 +0100
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"TechNet Mail Forum." <[log in to unmask]>, SVEBA <[log in to unmask]>
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Hello Technetters,
I have understood from different sources that use of thin plastic packages like TSOP and TQFP is not rekommended in more severe environments. Does anyone know the reason for that?
Are there tests done that show bad reliability over time or is the problem that they cannot withstand the soldering process?

Regards
Sven-Eric Bäckström

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