Subject: | |
From: | |
Reply To: | |
Date: | Wed, 21 Feb 2018 19:41:21 +0000 |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
Victor,
The the connector technical specification should lead you to some interesting insights!
Good hunting.
Gerry
> On Feb 21, 2018, at 2:09 PM, "[log in to unmask]" <[log in to unmask]> wrote:
>
> Dell - Internal Use - Confidential
>
> Fellow TechNetters:
>
> Any additional comments and/or concern over the gold finger edge being Beveled/Coined/Chamfered. Many a times do I see socket with gold plated wire contact gouges from DIMM product that has not been beveled/Coined/Chamfered, even bent pins.
>
> Victor,
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Jose A Rios
> Sent: Wednesday, February 21, 2018 8:15 AM
> To: [log in to unmask]
> Subject: Re: [TN] DIMM Modules Gold Finger Edge - Bevel/Coined/Chamfer
>
> I don’t know of a fully fledged std for it, other than workmanship acceptance criteria in 6012 and possibly mentions of design guidance in 2221
>
> Sent from my iPhone
>
>> On Feb 21, 2018, at 8:57 AM, "[log in to unmask]" <[log in to unmask]> wrote:
>>
>> Fellow TechNetters:
>>
>> Does IPC still have a STD for the above stated processt? If so, can someone direct me to the document.
>>
>> Victor,
|
|
|