We also have seen this problem, and whereas it could be developing, as
Franklin suggests, we see it more often as excessive drying, or even occasionally
excess exposure issues.

The root really is that the Copper is reacting with the soldermask, and
making it impossible to develop away.  We have actually created a cleaner
specifically to deal with this problem, but it is a band-aid, and usually can be
handled with process changes.

Rudy Sedlak

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