Sender: |
|
X-To: |
|
Date: |
Thu, 10 Jun 2004 13:39:58 -0700 |
Reply-To: |
|
Subject: |
|
From: |
|
Content-Transfer-Encoding: |
7bit |
In-Reply-To: |
|
Content-Type: |
text/plain; charset="iso-8859-1" |
MIME-Version: |
1.0 |
Parts/Attachments: |
|
|
Stress has been measured 1" in from a v-groove as it is being disassembled.
That is why routing and routing/mousebites continue to be designed in. It
all depends on the design and physical charateristics of the unit. We used a
machine nick-named the "pizza cutter". We went to manual pizza cutter over
electric because the tendency to lose the groove and wipe out the board was
too easy with electric.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Greg Scott
Sent: Thursday, June 10, 2004 12:57 PM
To: [log in to unmask]
Subject: Re: [TN] Subject: V-Groove Keep Out Area
Yes, Its true. Ceramic components crack very easily. We had several
board designs with ceramic caps within
5 mm from score edge. Caps cracked almost every time the boards were
separated, until we built a fixture
to support PCA while boards were separated. We also use a Mistro (sp?)
to break v-score.
Barr, Bob wrote:
>I have been given a v-groove score keep out area dimension of 1mm from the
>edge of the groove to the component body; except the dimension becomes 5mm
>for ceramic components. 5mm seems like a very large value. Does anybody
have
>experience with this? Is it really necessary to keep ceramic components
that
>far from a v-groove score?
>
>Thanks.
>
>Bob
>
>---------------------------------------------------
>Technet Mail List provided as a service by IPC using LISTSERV 1.8e
>To unsubscribe, send a message to [log in to unmask] with following text in
>the BODY (NOT the subject field): SIGNOFF Technet
>To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
>To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
>Search the archives of previous posts at: http://listserv.ipc.org/archives
>Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16
for additional information, or contact Keach Sasamori at [log in to unmask] or
847-509-9700 ext.5315
>-----------------------------------------------------
>
>
>
>
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16
for additional information, or contact Keach Sasamori at [log in to unmask] or
847-509-9700 ext.5315
-----------------------------------------------------
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
-----------------------------------------------------
|
|
|