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Wed, 16 Jul 1997 9:44 -0800 |
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| >From willli Wed Jul 16 11: |
37:48 1997 |
| From [log in to unmask] Mon Jul 21 11: |
22:18 1997 |
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by ipc.org (Smail3.1.28.1 #2)
id m0woX4r-000BkpC; Wed, 16 Jul 97 11:37 CDT |
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A tented via relates to dry film soldermask. The dry film is applied to
the whole panel, but some selected vias are not exposed or developed off.
This method completely encapsulates the via. Most shops have moved away
from the dry film soldermask technology because the same end result can
be obtained through LPI with via capping. The LPIs have better SIR and
Ionic cleanliness properties, and are more robust.
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From: Engineering / Design Dept.[SMTP:[log in to unmask]]
Sent: Wednesday, July 16, 1997 11:38 AM
To: jamesken; davidbo; technet
Subject: FAB : tented vias
Can anybody explain what a tented via is?
Thanks
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