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Subject:	Re: Underfill epoxy for flip chip
From:	ed hale <[log in to unmask]>
Reply To:	TechNet E-Mail Forum.
Date:	Tue, 21 Jul 1998 12:32:41 +1000
Content-Type:	text/plain
Parts/Attachments:	text/plain (47 lines)

>     Hi,
>
>     I am looking for a underfill material for our flip chip with solder
>     bump. I very appreciate if someone can recommend the suppliers and
>     comment its advantage or disadvantage.
>
>     Thank you
>
>
>     Eden

--------------------------------------------------------------------------------
--------------
 Eden,
        Try Emerson & Cuming - they have a Singapore office and Allen Chen
should be able to  give tech support. I think the phone no is (65) 831 4142

Regards,


>
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