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December 2001

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TechNet <[log in to unmask]>
Subject:
Re: tin compatalbe etchants
From:
Dennis Fritz <[log in to unmask]>
Date:
Mon, 17 Dec 2001 09:52:45 EST
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"TechNet E-Mail Forum." <[log in to unmask]>
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Adam -

Sorry, I misread your second question - no mask to be applied.  Stripping the
tin will mean no copper/tin intermetallic can be formed in storage.  Think
then the question for you is whether your assembly system flux is more
compatible with tin, or with bare copper, probably protected by Organic
Solderability Preservative (OSP).

Denny Fritz

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