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July 1998

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Subject:
Re: BGA Ball Attachment Process
From:
sahmad <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 20 Jul 1998 09:41:08 -0600
Content-Type:
text/plain
Parts/Attachments:
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Pac Tech, Am Schlangenhorst 15-17, D-14641 Nauen, Germany
Ph 49 0 30 467 815 71 Fax 49 0 30 467 815 27
Contact Elke Zakel, Dr.-Ing., General Manager, [log in to unmask]

        -----Original Message-----
        From:   Kathy Palumbo [SMTP:[log in to unmask]]
        Sent:   Friday, July 17, 1998 12:23 PM
        To:     [log in to unmask]
        Subject:        [TN] BGA Ball Attachment Process

        I need to attach BGA balls to a PCB.  Does anyone out there know how
this
        Balling process should be done?

        Is there anyone out there capable of performing this Balling Process
for me,
        or can you recommend equipment that could do it for me?

        Your help in this matter is greatly appreciated!!

        Thanks in advance!!

        Sincerely,
        Kathy Palumbo

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