Can you epoxy a wire to the top of the device, then apply vertical force to pull it off the board?
The maximum force may also be a useful indicator.
Blair
On Tue, 10 Apr 2012 07:27:45 -0500, Victor Hernandez <[log in to unmask]> wrote:
>Fellow TechNetters:
>
> I am aware that D&P is typically done on BGA solder bump and the criteria is the flat surface area. If some wanted to apply this same technique/method to a leaded component ie. Gull wing, J lead, etc. How could one calculate the mating area/surface. They are totally different. Besides that, it is difficult to pull the leads straight up. Any thought/comments will be greatly appreciated.
>
>Victor,
>
>
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