TECHNET Archives

September 1997

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Sender:
TechNet Mail Forum<[log in to unmask]>
Subject:
Coefficient of thermal expansion
From:
"COLLINS, GRAHAM" <[log in to unmask]>
Date:
Wed, 17 Sep 1997 07:58:21 -0400
Content-Type:
multipart/mixed; boundary="---- =_NextPart_000_01BCC417.A7B04410"
MIME-Version:
1.0
Reply-To:
"TechNet Mail Forum." <[log in to unmask]>, "COLLINS, GRAHAM" <[log in to unmask]>
Parts/Attachments:
text/plain (191 bytes) , application/ms-tnef (1788 bytes) 
Good day TechNet.
A quick one: can somebody tell me the coefficient of thermal expansion
of FR4 board material?

Thanks!

Graham Collins
Litton Systems Limited, Atlantic Division
(902) 873-2000 ext 215

ATOM RSS1 RSS2