I am currently evaluating what machine or process is better for Selective
Soldering. I have information on Air-Vac PCBRM 12 (System 1) and also am looking
into RPS Opus Point Soldering Robot. I need more information regarding what
should I be considering in the evaluation of these types of machines/processes
(Point Soldering with direct heat, microflame, laser and selective wave
soldering, with having to have specific flow wells for each type of design. Will
be conducting an evaluation to determine what type of system is better and why
(considering quality of joints, process speed, flexibility, programming ease,
etc.
Have any of you had any experience with these types of processes? Any headaches,
growing pains, etc. (other than process startup) that you would like to share?
Any and all responses welcome. Thanks in advance

Ivan Barrios

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