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Date: | Thu, 23 Jun 2016 11:30:58 -0500 |
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Hi John - are we talking about thermal cycling of assemblies for solder
joint/design integrity or thermal cycling of boards for laminate integrity?
The IPC-9701 specification covers the thermal cycling of assemblies and is
commonly used.
Dave Hillman
Rockwell Collins
[log in to unmask]
On Thu, Jun 23, 2016 at 11:13 AM, John Burke <[log in to unmask]> wrote:
> Good morning !!
>
>
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> A question came up on reliability testing.
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> Typically PCBA's are thermally cycled as a part of reliability testing
> usually for 1000 cycles.
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> What is the group's experience for non-military thermal cycling ranges?.
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> I am often asked to use 0 - 100c sometimes -40 to 85c and sometimes various
> other thermal cycles picked from the JEDEC standard.
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> What is the groups experience for this?. I am trying to establish "normal"
> practice.
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> Best regards,
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> John
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>
>
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