TECHNET Archives

October 2001

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Content-Type:
multipart/alternative; boundary="----=_NextPart_000_0024_01C15D3E.9C374D30"
Sender:
TechNet <[log in to unmask]>
Subject:
Re: In Search of Thick Cu PCB Manufacturer
From:
Dean Lillibridge <[log in to unmask]>
Date:
Thu, 25 Oct 2001 10:20:02 -0400
In-Reply-To:
<[log in to unmask]>
MIME-Version:
1.0
Reply-To:
"TechNet E-Mail Forum." <[log in to unmask]>
Parts/Attachments:
text/plain (741 bytes) , text/html (1489 bytes)

ATOM RSS1 RSS2