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January 2007

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TechNet <[log in to unmask]>
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[log in to unmask], [log in to unmask], [log in to unmask]
Date:
Fri, 19 Jan 2007 14:22:18 EST
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TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Subject:
Re: Minimum solder reflow temperatures for ENIG board finish
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From:
Werner Engelmaier <[log in to unmask]>
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Hi Richard &Tom,
The article you are referring to: "Soldering: Quality and Reliability Issues" 
was published in global SMT & Packaging Vol. 1, No. 2, August 2001. You may 
also be interested in the column “The Case Against ENIG,” Global SMT & 
Packaging, Vol. 5, No. 6, June/July 2005 [EU-edition].

Werner

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