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November 2000

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TechNet <[log in to unmask]>
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Date:
Mon, 27 Nov 2000 09:48:14 EST
Reply-To:
"TechNet E-Mail Forum." <[log in to unmask]>, [log in to unmask]
Subject:
Re: Ni/Au solderabilty
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From:
"<Rudy Sedlak>" <[log in to unmask]>
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Suspect strongly that most, if not all of your problems would go away if the
quality of the Gold plate was better (reduced porosity).

Rudy Sedlak
RD Chemical Company

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