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January 2006

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TechNet E-Mail Forum <[log in to unmask]>
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Wed, 11 Jan 2006 12:24:47 -0500
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TechNet E-Mail Forum <[log in to unmask]>, "Creswick, Steven" <[log in to unmask]>
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Steve,

This sounds excessive to me.

A good, clean interleaf paper is all that I ask for to prevent burnishing damage from one board to the next.

We will perform plasma cleaning prior to wire bonding, but that is because other operations have been done upstream [in-house].  I would do this even if the vendor plasma cleaned the boards.

You/they could always do a wetting angle test to see just how 'clean' the boards actually were upon arrival - comparing against those that had not been plasma pre-cleaned...

Steve Creswick - Gentex 




-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Steve Kelly
Sent: Wednesday, January 11, 2006 10:18 AM
To: [log in to unmask]
Subject: [TN] Wire bondable gold pads


Good Morning to all,
We manufacture various circuits with electroplated wire bondable gold.
As the final operation before packaging and shipping we plasma clean.
Our customer is under the impression that the gold can contaminate
during shipping and storage. My question is do other suppliers do
special nitrogen/vacuum packaging of product like this to prevent this
or is this something that should not be happening. Thanks in advance.
Steve Kelly

Steve Kelly
PH: (416) 750-8433
FAX: (416) 750-0016
CELL: (416) 577-8433


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