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May 1998

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Sender:
TechNet <[log in to unmask]>
Date:
Wed, 27 May 1998 13:02:13 +0800
Reply-To:
"TechNet E-Mail Forum." <[log in to unmask]>, Kelvin Ang <[log in to unmask]>
Subject:
Re: surface mount solder joints
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TECOMAS (M) SDN BHD
From:
Kelvin Ang <[log in to unmask]>
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text/plain (31 lines) 
> Hello Technet,
> 1) I would like to better understand the relationship between smooth
> and
> shinning solder
>     joints and reflow profile.eg: i've used different types of
> no-clean
> solder pastes and     observed differences in the solder joint
> finish.Some are smooth and shinning while
> others are somewhat dull and have scratchy lines on the solder
> surface.i've tried to increase the soak zone dwell time but have not
> been able to improve the finish.
>
> 2) can you also tell me if there will be any difference between sn63
> and
> ag2 % alloys
> with regards to the shinning joints?
> thanks.
> kelvin.

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