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Reply To: | TechNet E-Mail Forum. |
Date: | Fri, 24 Sep 1999 14:50:59 EDT |
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Hi Jason,
Get yourself a copy of IPC-D-279, Design Guidelines for Reliable Surface
Mount Technology Printed Board Assemblies, and read Appendix A so you know
what is important for solder joint reliability. Appendix A also gives you a
solder joint reliability model. Be careful with FEM on solder joints, because
I am quite sure you do not have the necessary property information. There are
in infinite stress-strain diagrams dependent on temperature and strain rate,
as do the yield and ultimate strength, the modulus of elasticity and the
ductility.
Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL 32174 USA
Phone: 904-437-8747, Fax: 904-437-8737
E-mail: [log in to unmask], Website: www.engelmaier.com
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