Hi Jason,
Get yourself a copy of IPC-D-279, Design Guidelines for Reliable Surface
Mount Technology Printed Board Assemblies, and read Appendix A so you know
what is important for solder joint reliability. Appendix A also gives you a
solder joint reliability model. Be careful with FEM on solder joints, because
I am quite sure you do not have the necessary property information. There are
in infinite stress-strain diagrams dependent on temperature and strain rate,
as do the yield and ultimate strength, the modulus of elasticity and the
ductility.

Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL  32174  USA
Phone: 904-437-8747, Fax: 904-437-8737
E-mail: [log in to unmask], Website: www.engelmaier.com

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in
the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information.
If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or
847-509-9700 ext.5365
##############################################################