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July 1998

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Subject:
Automated COF Assembly
From:
Jay Bitanga <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 22 Jul 1998 08:41:12 +0000
Content-Type:
text/plain
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text/plain (64 lines) 
Gentlemen,

Thank you very much for the information shared to us regarding
Chip-On-Flex.  We will bear this in mind.  But we would also want to
know if you have a basic or extended knowledge in automated COF
Assembly.  We initially saw a problem in automating COF especially in
the wire bonder and curing oven because of the transfer of the
palette from the conveyors to the wire bonder or curing oven for
that matter.  Are you familiar with machines that are suitable for
fully automated COF assembly (e.g. wire bonder , curing oven, etc.) ?
Can you explain to us plasma cleaning ?  How does it differ from
aqueous cleaning...
Thank you once again and hope to hear from you very soon !!!


Regards,

Edwin V. Maximo
Value Engineer
Electronic Assemblies Inc.
e-mail : [log in to unmask]

Jay Bitanga
Value Engineer
Electronic Assemblies Inc.
e-mail : [log in to unmask]

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