TECHNET Archives

February 2014

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Sender:
TechNet <[log in to unmask]>
X-To:
Technet <[log in to unmask]>
Date:
Thu, 6 Feb 2014 13:14:46 +0000
Reply-To:
TechNet E-Mail Forum <[log in to unmask]>, Lars Wallin <[log in to unmask]>
Message-ID:
<[log in to unmask]>
Subject:
VB: Lödproblem + bild
From:
Lars Wallin <[log in to unmask]>
Content-Transfer-Encoding:
quoted-printable
In-Reply-To:
<002201cf233a$ce731e80$6b595b80$@[log in to unmask]>
Content-Type:
text/plain; charset="iso-8859-1"
MIME-Version:
1.0
Parts/Attachments:
text/plain (19 lines) 
Hello Technet,

Please check the attach sketch.
It involves soldering a large capacitor (20 x 30 x 40 mm see enclosed picture) and then mould in the whole board with a warm polyuretan mould mass. The requirement is that the solder joint should withstand 300 cycles (from-40C to +85 C).

Figure A, can not cope with the requirement of 300 cycles. a =  polyurethane mass.

Which of the figures B-E do you think would be a better solution? Or would you suggest any other solution?

Looking forward to your answer.

Best Regards
Lars Wallin
IPC European Representative
Location: Stockholm, Sweden
Phone:  +46 8 26 10 07
Mobile: +46 70 212 74 39
Email: [log in to unmask]<mailto:[log in to unmask]>

ATOM RSS1 RSS2