Bruce,

Thanks much. I hope everyone responding (like Mike Fenner & sorry about
your slow computer situation), whether on or off forum, knows I'm only using
these parts in a new product and they ain't workin.' I'm not making the
parts. Therefore, I have little idea how they come together under what
conditions but for obvious dicing, die attach/bond, and wire bonding.

I'm still leaning toward a possibility that cracking is occurring in the die
because of the warpage and subsequent thermal stress. Thanks again for the
die penetrant process for crack detection. Hope I don't have to go that far,
but whatever it takes.

Thank you Bill Campbell for your offerings. Ms. Koo is to be commended as
well even though she likes money and games, or so it would seem. Whos is
this lady? She says you all know her. I think she's hiding something. Do you
folks think it wise to pay to find out what?

Ingemar, I know you would have responded more but for lack of information.
Don't know what else, yet, to provide pal.

I have just a couple more images to post before, hopefully with all your
help, a final conclusion's pics and analysis is provided. Feel close to
resolution even after absorbing many hundreds of pages about GaAs FET MMIC
high power/speed R/F amplifiers.

Who is that lady?

MoonMan

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