Bruce, Thanks much. I hope everyone responding (like Mike Fenner & sorry about your slow computer situation), whether on or off forum, knows I'm only using these parts in a new product and they ain't workin.' I'm not making the parts. Therefore, I have little idea how they come together under what conditions but for obvious dicing, die attach/bond, and wire bonding. I'm still leaning toward a possibility that cracking is occurring in the die because of the warpage and subsequent thermal stress. Thanks again for the die penetrant process for crack detection. Hope I don't have to go that far, but whatever it takes. Thank you Bill Campbell for your offerings. Ms. Koo is to be commended as well even though she likes money and games, or so it would seem. Whos is this lady? She says you all know her. I think she's hiding something. Do you folks think it wise to pay to find out what? Ingemar, I know you would have responded more but for lack of information. Don't know what else, yet, to provide pal. I have just a couple more images to post before, hopefully with all your help, a final conclusion's pics and analysis is provided. Feel close to resolution even after absorbing many hundreds of pages about GaAs FET MMIC high power/speed R/F amplifiers. Who is that lady? MoonMan --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------