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| Date: | Tue, 6 Nov 2012 09:42:05 -0600 |
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Foresite, Inc. publishes their recommended cleanliness limits for No Clean
Flux within their Test Reports.
Eric Camden and Terry Munson are the ones to contact at 765-457-9033 or at
[log in to unmask]
John Balchunas | Engineer
Entegris, Inc. | 5155 E River Rd Ste 406 | Fridley, MN 55421 USA
T +1 763 528 4811
[log in to unmask] | www.entegris.com
From: SALA GABRIELE <[log in to unmask]>
To: <[log in to unmask]>
Date: 11/05/2012 06:10 PM
Subject: [TN] R: [TN] Limits on flux residue
Sent by: TechNet <[log in to unmask]>
Hi wayne,
as far as I know, no specs are available to define the limits of NC
flux residue left on solder joints.
Theoretically no halide should be entrapped in the NC flux residue,so no
problem, but let's not forget such residues could be moisture absorber
and
that could mean a potential reliability issue when blending flux residues
with moisture (ECM), in such a narrow gap between BGA substrate and pcb..
Gabriele
-----Messaggio originale-----
Da: TechNet [mailto:[log in to unmask]] Per conto di Thayer, Wayne - IS
Inviato: marted́ 6 novembre 2012 0.50
A: [log in to unmask]
Oggetto: [TN] Limits on flux residue
Is there a spec somewhere which limits the amount of residue allowed for
no
clean processing? I just saw a board where a BGA was about 70%
"underfilled" by flux residue. No, this was not a flux/underfill product!
A quick look at JSTD-001 Section 8 didn't seem to have specific guidance
on
this condition.
Wayne Thayer
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