Foresite, Inc. publishes their recommended cleanliness limits for No Clean Flux within their Test Reports. Eric Camden and Terry Munson are the ones to contact at 765-457-9033 or at [log in to unmask] John Balchunas | Engineer Entegris, Inc. | 5155 E River Rd Ste 406 | Fridley, MN 55421 USA T +1 763 528 4811 [log in to unmask] | www.entegris.com From: SALA GABRIELE <[log in to unmask]> To: <[log in to unmask]> Date: 11/05/2012 06:10 PM Subject: [TN] R: [TN] Limits on flux residue Sent by: TechNet <[log in to unmask]> Hi wayne, as far as I know, no specs are available to define the limits of NC flux residue left on solder joints. Theoretically no halide should be entrapped in the NC flux residue,so no problem, but let's not forget such residues could be moisture absorber and that could mean a potential reliability issue when blending flux residues with moisture (ECM), in such a narrow gap between BGA substrate and pcb.. Gabriele -----Messaggio originale----- Da: TechNet [mailto:[log in to unmask]] Per conto di Thayer, Wayne - IS Inviato: marted́ 6 novembre 2012 0.50 A: [log in to unmask] Oggetto: [TN] Limits on flux residue Is there a spec somewhere which limits the amount of residue allowed for no clean processing? I just saw a board where a BGA was about 70% "underfilled" by flux residue. No, this was not a flux/underfill product! A quick look at JSTD-001 Section 8 didn't seem to have specific guidance on this condition. Wayne Thayer ________________________________ Email addresses of ITT Exelis employees have changed from itt.com to exelisinc.com. Please update your favorites and contact information to reflect these changes. This e-mail and any files transmitted with it may be proprietary and are intended solely for the use of the individual or entity to whom they are addressed. If you have received this e-mail in error please notify the sender. Please note that any views or opinions presented in this e-mail are solely those of the author and do not necessarily represent those of Exelis Inc. The recipient should check this e-mail and any attachments for the presence of viruses. Exelis Inc. accepts no liability for any damage caused by any virus transmitted by this e-mail. ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________ ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________ ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________