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May 1997

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>From bergdi Thu May 22 18:
09:06 1997
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Subject:
IPC A 600 E:vert hasl
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Jim Herard <[log in to unmask]>
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57:18 1997
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A thickness range of 80-1500 microinches w/pad to pad planarity of 600
microinches seems to work well.  Height across an individual pad should not
matter unless the pad is very very large -- like maybe 0.250" on each side,

Other Thoughts?

Jim Herard
IBM Microelectronics
---------------------- Forwarded by Jim Herard/Endicott/IBM on 05-22-97 07:15 PM
 ---------------------------

        linaks @ lw1.vsnl.net.in
        05-22-97 02:38 PM
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To: TechNet @ ipc.org @ internet
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Subject: IPC A 600 E

IPC A 600 E is silent on the acceptibility criteria for  solder coating
on SMD pads done by Vertical HASL machines.

Since these rectangular SMD pads are placed along 'X' and 'Y' axis both
on the same card perfect uniformity is never possible. IPC Technical
talent pool should be able to throw some light on it.

P. V. Khan
Chief Quality Manager
Linaks Microelectronics Limited


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