Subject: | |
From: | |
Reply To: | |
Date: | Mon, 7 Feb 2005 11:51:27 -0000 |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
Look into how much reworking goes on.
With an OSP you may not be able to have a 2nd/3rd run through an oven etc.
Hand soldering bare pads afterwards has also been an issue.
Although if you have some boards on the shelves 12 months later, you can always send em back to be stripped & recoated, which can be done with OSP.
I have been told that I am not allowed to spec it, Tin, Silver or Gold only for now.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of David Harman
Sent: Friday, February 04, 2005 5:17 PM
To: [log in to unmask]
Subject: [TN] OSP process for PCB
Can anyone help me understand the difference between gold immersion and
the new technologies (OSP) ORGANIC SOLDERABILITY PRESERVATION, my
understanding is OSP, immersion silver and immersion tin are the leading
lead-free alternatives.
My vendor is asking us to change from a gold immersion to this OSP
process. What are the positives and or negatives for this process? What
do I need to look for? Are there any limitations that may affect RF
performance? Is this process better then gold immersion and if so why?
Comparing OSP to immersion silver or immersion tin, Is this the
direction of the industry? What about reliability?
Any assistance in this would be helpful.
Thanks
David
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------
|
|
|