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Thu, 23 Oct 2003 09:34:29 +0300 |
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You should develop your own follow up table. (beside the incoming
inspection statistical method of accept / reject table).
I recommend follow up table of common rejects families (mech. deviations,
warpage, solderability, drills diameter, finish plating / coating,
documents, solder mask, solder balls etc.) for each supplier per shipment
and per major or minor failure.
After a while you will see that each supplier has its typical failure that
should be analyzed and to be corrected.
Best Regards
ROKAH Reuven
e mail: [log in to unmask]
bob wettermann
<[log in to unmask] To: [log in to unmask]
NET> cc:
Sent by: TechNet Subject: [TN] Board Shop Outgoing QC Measurement
<[log in to unmask] Suggestions
>
23/10/03 03:10
AM
Please respond
to "TechNet
E-Mail Forum.";
Please respond
to bob
wettermann
What is the the most common practice for measuring the outgoing QC levels
of a PCB fabrication facility? Are ppm defect rates used? If so how are
they practically measured-by the number of solder joints, the number of
operations performed per board or...?
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Bob Wettermann
PH 847-767-5745
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